High-Frequency Communications
Case Study
Fluoplus® High-Performance Fluoromaterials: Empowering High-Frequency Communications and High-Speed Signal Transmission
Amidst the accelerating trend toward higher frequencies, increased speeds, and lightweight designs in 5G and 6G communications, signal transmission rates, dielectric loss, and dimensional stability have emerged as core challenges. The Fluoplus® MK/LK series—comprising high-frequency films and foamed fluoroplastic pellets introduced by Fluoever—stands out as an ideal material solution for applications such as high-frequency antennas, RF cables, and high-speed data transmission lines, thanks to its exceptionally low dielectric constant and dielectric loss, as well as its superior thermal resistance and dimensional stability.
Fluoplus® MK Films & Fluoplus® LK Films

Product Information
Fluoplus® MK and LK films are manufactured using a proprietary melt extrusion casting process developed in-house, utilizing low-dielectric fluorinated materials. These films feature smooth surfaces and exhibit exceptional performance characteristics. They are amenable to various secondary processing techniques—including heat sealing, welding, metallization, lamination with other materials, and vacuum forming—making them ideally suited for high-frequency signal transmission antennas and transmission components within the aerospace, telecommunications, and consumer electronics sectors.
Product Features
- – Ultra-Low Dielectric Performance: The LK series features an extremely low dielectric constant (Dk as low as 2.35 @ 10 GHz) and dielectric loss (Df as low as 0.0008 @ 10 GHz), while the MK series meets requirements for moderate dielectric constants; both ensure high-frequency signal integrity and low-latency transmission.
- – Superior Electrical Reliability: Compared to other film materials, these films demonstrate outstanding electrical reliability, characterized by high dielectric strength (35 kV/mm).
- – Chemical Resistance: Exhibiting strong chemical inertness, the films can withstand exposure to strong acids commonly encountered in various applications and serve as effective barriers against most gases and liquids.
- – Thermal Stability: Capable of long-term operation within a temperature range of -150°C to 200°C, the films also meet the stringent requirements for immersion in molten solder at 288°C.
- – Excellent Mechanical Properties: Featuring high impact strength, tear resistance, and superior flexural endurance, these films are well-suited for installation in confined or space-constrained environments.
- – Long-Term Weatherability: The films can withstand prolonged outdoor exposure without any degradation in performance.
Typical Applications
- -5G/6G Antennas: High-frequency antenna substrates, antenna radiating elements, radomes
- -RF Front-end Modules: RF circuit substrates, filter dielectric layers
- -Satellite Communications: Spacecraft antenna assemblies, high-frequency signal transmission components
- -Consumer Electronics: Smartphone antenna FPCs, tablet antenna modules
Foaming Fluoroplastic Series (PFA, FEP, ETFE, PVDF)
Product Information
Fluoever introduces a series of high-performance foameing fluoroplastic, encompassing a wide range of base materials such as PFA, FEP, ETFE, and PVDF. By injecting N2 or CO2 gas into the fluoroplastics, the dielectric constant of the material is effectively reduced, thereby minimizing signal transmission loss while simultaneously enabling the lightweighting and miniaturization of cables. These products are ideally suited for applications in high-frequency data cables, coaxial cables, Local Area Network (LAN) cables, and similar fields.
Product Features
- – Significantly Reduced Dielectric Constant: After foaming, the dielectric constant is lower than that of solid FEP, resulting in a higher signal transmission velocity factor.
- – Reduced Dielectric Loss: The foamed structure lowers the dielectric loss tangent, endowing the cable with lower capacitance and attenuation.
- – Lightweight: Foaming rates can reach 30%–60%, significantly reducing cable weight.
- – Long-Term Thermal Stability: Capable of withstanding temperatures up to 260°C.
- – Miniaturization: A lower dielectric constant allows for the use of thinner insulation layers while maintaining equivalent signal transmission performance.
- – UL Certified: The foamed fluoroplastic granules are UL certified and suitable for use as insulation layers in duct cables.
Typical Applications
Electronic Product Antenna Feeders, Phase-Stable Cables, Ultrasonic Interconnect Cables, Ultra-High-Speed Network Cables, Test Cables, Data Center Interconnect Cables