Semiconductor/LED Packaging Application

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Fluoplus® ETFE Release Film: Advanced Semiconductor/LED Packaging Application

In the semiconductor industry, our high-performance ETFE release films serve as an ideal process packaging solution, distinguished by their exceptional non-stick properties, high-temperature resistance, and freedom from extractables.

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ETFE Release Film

  • Used under up to 240 ℃
  • Prevents the formation of burrs and flash during the molding process
  • Brings easier mold release of products, eliminating the need for additional ejection mechanisms
  • Prevents the buildup of mold residue after long time working
  • Matte surface ETFE release films impart a matte surface effect to molded product

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